Lippage Removal Pads

Standard “STCD” 3 inch Super True ceramic lippage removal pads

Item No.: STCD-SW003
Ceramic bond diamond polishing pads for lippage removal are an essential part of the grinding process
  • Diameter: 3 inch
  • Grit No.: #30.50.100.200.400
  • Thickness: 7mm
  • Speed: 500-800RPM
  • Usage(Dry/Wet): Wet
  • Optimal: Granite Marble Engineered Stone, Terrazzo
  • Description

    ”STCD” super true ceramic transitional diamond polishing pad are our latest diamond tool development and results in a superior floor with reduced steps.
    The ceramic polishing pad is designed to cut and remove lippages easily and fast without scratches. The grinding process to a resin polishing process. These diamonds polishing pads are designed to work on 17 inch floor polisher, medium and large planetary and rotary machines.
    Ceramic bond diamond polishing pads for lippage removal are an essential part of the grinding process, as lippage removal is among the first steps in preparing a floor for polishing. They perform excellently on concrete, natural, and engineered stones. Brazed lippage pads are designed for wet applications only.
    Ceramic bond diamond polishing pads for lippage removal are very aggressive because the diamonds open quicker than sintered bond tools.

    Item No. Description
    STCD-SW003-50 3”/80mm ceramic wet polishing pad, #50
    STCD-SW003-100 3”/80mm ceramic wet polishing pad, #100
    STCD-SW003-200 3”/80mm ceramic wet polishing pad, #200
    STCD-SW003-400 3”/80mm ceramic wet polishing pad, #400